Thermomechanical behavior of ceramic ball grid array based on experiments and FEM simulations

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1996, Pages 91-98

  Deletage, J Y ^a   Fenech, A ^a   Bechou, L ^a   Ousten, Y ^a   Danto, Y ^a   Salagoity, M ^a   Faure, C ^a   Rao, S ^a  

^a UNIVERSITÉ DE BORDEAUX   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMAGING; AGING OF MATERIALS; CERAMIC MATERIALS; DEGRADATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; STRAIN; THERMAL CYCLING; THERMAL STRESS;

CERAMIC BALL GRID ARRAY (CBGA); CUMULATIVE STRAIN;

ELECTRONICS PACKAGING;

EID: 0030383738     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)