Quantitative measurements of subcritical debonding of Cu films from glass substrates

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 183-188

  Pang, M ^a   Baker, S P ^a  

^a School of Operations Research and Industrial Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHROMIUM; CRACK PROPAGATION; DEBONDING; FLAT PANEL DISPLAYS; GLASS; SUBSTRATES; THIN FILMS;

KINETIC CRACK MODEL; SILICATE GLASS SUBSTRATES; STRAIN ENERGY;

COPPER;

EID: 0348199124     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-766-e2.8     Document Type: Conference Paper

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