Flat rates on future silicon wafers: Precision grinding

Industrial Diamond Review

Volumn 60, Issue 585, 2000, Pages 149-156

  Klocke, F ^a   Jakob, A ^a   Pähler, Dietmar ^a   Gerent, Oliver ^a  

^a FRAUNHOFER INSTITUTE FOR PRODUCTION TECHNOLOGY IPT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347744962     PISSN: 00198145     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. ITRS; http://www.itrs.net.
2. H. Engel. Läppen von einkristallinem Silizium. Dissertation, Technische Universität Berlin, 1997.
3. T. Abe. A Future Technology for Silicon Wafer Processing for ULSI. Precision Engineering 13 (1991) 4, p. 251-255.
4. G. Könnemann, H. Eichhorn, R. Petzold. Nanogrinder for High Precision Machining of Silicon Wafers. Industrial Diamond Review 59 (1999) 1, p. 30-33.
5. F. Klocke, O. Gerent, D. Pähler. Effiziente Prozesskette zur Waferfertigung. ZWF 95 (2000) 3, p. 79-82.
6. W.F. Struth. Innentrennschleifen von einkristallinem Silizium. Dissertation, RWTH Aachen, 1988.
7. G.R. Anstis, P. Chantikul, B.R. Lawn, D.B. Marshall. Critical Evaluation of Indentation Techniques for Measuring Fracture Toughness: I Direct Crack Measurements. Journal of the American Ceramic Society, 64 (1981) 9, p. 533-538.