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Volumn 95, Issue 3, 2000, Pages 79-82

Effiziente prozesskette zur waferfertigung

Author keywords

[No Author keywords available]

Indexed keywords

LAPPING; SILICON WAFERS;

EID: 0039339101     PISSN: 09470085     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (5)

References (8)
  • 7
    • 0026239071 scopus 로고
    • A future technology for silicon wafer processing for ULSI
    • Abe, T.: A Future Technology for Silicon Wafer Processing for ULSI. Precision Engineering 13 (1991) 4, S. 251-255
    • (1991) Precision Engineering , vol.13 , Issue.4
    • Abe, T.1
  • 8
    • 0040427126 scopus 로고    scopus 로고
    • Nanogrinder for high precision machining of silicon wafers
    • Könnemann, G.; Eichhorn, H.; Petzold, R.: Nanogrinder for High Precision Machining of Silicon Wafers. Industrial Diamond Review 59 (1999) 1, S. 30-33
    • (1999) Industrial Diamond Review , vol.59 , Issue.1 , pp. 30-33
    • Könnemann, G.1    Eichhorn, H.2    Petzold, R.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.