The influence of adhesive composition on mechanical and electrical properties of joints between SMDs and PCBs

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 240-242

  Kisiel, R ^a  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Composite materials; Conducting materials; Conductive adhesives; Design methodology; Electric resistance; Mechanical factors; Microelectronics; Polymers; Surface mount technology; Transmission line matrix methods

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; COATINGS; COMPOSITE MATERIALS; CONDUCTIVE MATERIALS; DESIGN OF EXPERIMENTS; ELECTRIC RESISTANCE; FILLERS; JOINING; MANUFACTURE; MATRIX ALGEBRA; MICROELECTRONICS; ORGANIC POLLUTANTS; PLASTIC COATINGS; POLYMER MATRIX COMPOSITES; POLYMERS; SURFACE MOUNT TECHNOLOGY;

CONDUCTING MATERIALS; CONDUCTIVE ADHESIVE; DESIGN METHODOLOGY; MECHANICAL FACTORS; TRANSMISSION LINE MATRIX METHODS;

PRINTED CIRCUIT BOARDS;

EID: 0347928914     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860609     Document Type: Conference Paper

References (6)

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2. Rosenberg Halle "Electrically Conductive Adhesives for SMT" Elektronik Centralen, Dennmark, August 1992
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4. Felba J., Friedel K,P., Kisiel R., Laska W. Mościcki A.: Solder Replacement with electrically Conductive Adhesives in Microwave Applications, IMAPS Symposium PRAGUE, June 2000 in printing
5. st International Spring Seminar on Electronics Technology ISSE'98, Austria, May 1998 pp. 32-33
6. Peace G.S.: Taguchi Methods - A Hands-On Approach, Addison Wesley 1993, Chapter 15 Level Average Analysis