Mechanical and electrical study of linear spring and J-Spring

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 2, Issue , 2002, Pages 387-394

  Ma, Lunyu ^a   Zhu, Qi ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Compliance; Compliant interconnect; IC fabrication; Inductance; Sputtering

Indexed keywords

MICROELECTRONIC PACKAGING; SELF INDUCTANCE MEASUREMENT;

COMPUTATIONAL GEOMETRY; ELECTRIC CONNECTORS; FINITE ELEMENT METHOD; INDUCTANCE MEASUREMENT; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONIC PROCESSING; OPTIMIZATION; PHOTOLITHOGRAPHY; SEMICONDUCTOR DEVICE MODELS; SPRINGS (COMPONENTS); SPUTTER DEPOSITION; STRESS ANALYSIS; THERMAL EXPANSION; THICKNESS MEASUREMENT; WSI CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0346971045     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-39683     Document Type: Conference Paper

References (4)

1. The International Technology Roadmap for Semiconductors (ITRS) - Assembly and Packaging (2001 Edition), Semiconductor Industry Association, 2001, pp.15.
2. th Electronic Components and Technology Conference, 2001, pp. 761 - 766
3. th Electronic Components and Technology Conference, 2002, pp. 910 - 914
4. Grover, F. W., "Inductance Calculations - Working Formulas and Tables", D. Van Nostrand, New York (1980), pp. 164-166