Near-threshold electromigration of damascene copper on TiN barrier

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 145-150

  Meyer, William K ^a   Solanki, Raj ^a   Evans, David ^b  

^a OREGON HEALTH AND SCIENCE UNIVERSITY   (United States)

^b SHARP LABORATORIES OF AMERICA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; DIFFUSION IN SOLIDS; ELECTRIC RESISTANCE; ELECTROMIGRATION; SATURATION (MATERIALS COMPOSITION); STRESS ANALYSIS; THERMAL GRADIENTS; TITANIUM NITRIDE;

BLACK EQUATION; DAMASCENE COPPER; RESISTANCE SATURATION; WAFER LEVEL STRESS;

COPPER;

EID: 0346938454     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-766-e3.24     Document Type: Conference Paper

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