Multichip-modules (MCMs) for micro-And millimeter-wave applications-A challenge?

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 279-284

  Oppermann, M ^a  

^a AIRBUS GROUP INNOVATIONS   (Germany)

Author keywords

MCM Technology; Multichip Module (MCM); Transmit Receive (T R) Module

Indexed keywords

ELECTRONIC EQUIPMENT TESTING; MICROPROCESSOR CHIPS; MILLIMETER WAVES;

ACTIVE PHASED ARRAY RADAR; COMMUNICATION MODULES; HIGH-VOLUME PRODUCTION; MILLIMETER-WAVE APPLICATIONS; MILLIMETER-WAVE SYSTEMS; STRINGENT REQUIREMENT; TRANSMIT/RECEIVE MODULES; WIRELESS INFRASTRUCTURES;

MULTICHIP MODULES;

EID: 84988754605     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670794     Document Type: Conference Paper

References (4)

1. H.-P. Feldle, Transmit/Receive Module Technology for Active Array Radar, Microwaves&RF, Oct. 96, pp. 2 15-220
2. H. Meinel, Automotive Millimeterwave Radar Technology A Production Challenge , to be present. at SAMPE/JEC 98, La Defense, Paris, 04/98
3. W. Bosch, Transmit/Receive Module Technology for Future System Design ? EuMCJerusalem, 09/97, pp. 20-25
4. B. Dufour et al, Microwave Multi-Chip Module Utilizing Aluminum Silicon Carbide with In-Situ Cast Components and High Density Interconnect Technology , Proceedings of 1994 MCM Conference, Denver, pp. 309-3 14