Hybrid epoxy-based thermosets based on polyhedral oligosilsesquioxane: Cure behavior and toughening mechanisms

Journal of Polymer Science, Part B: Polymer Physics

Volumn 41, Issue 24, 2003, Pages 3299-3313

  Kim, G M ^a,b   Qin, H ^a   Fang, X ^a,c   Sun, F C ^a,d   Mather, P T ^a  

^a UNIVERSITY OF CONNECTICUT   (United States)

^b MARTIN LUTHER UNIVERSITY HALLE WITTENBERG   (Germany)

^c UNDERWRITERS LABORATORIES INC   (United States)

^d UNIVERSITY OF NORTH CAROLINA   (United States)

Author keywords

Hybrid thermosets; POSS; Silsesquioxane; Toughening mechanism

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; GLASS TRANSITION; TEMPERATURE; THERMODYNAMIC PROPERTIES; TOUGHENING; TRANSMISSION ELECTRON MICROSCOPY;

DYNAMIC STORAGE MODULUS; POLYHEDRAL OLIGOSILSESQUIOXANE; RHEOMETRY; TOUGHENING MECHANISM;

THERMOSETS;

EID: 0346361539     PISSN: 08876266     EISSN: None     Source Type: Journal    
DOI: 10.1002/polb.10703     Document Type: Article

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