Electropolymerization of DBSA-doped polypyrrole films on PTFE via an electroless copper interlayer

Surface and Interface Analysis

Volumn 35, Issue 12, 2003, Pages 974-983

  Prissanaroon, W ^a   Brack, N ^a   Pigram, P J ^a   Liesegang, J ^a  

^a LA TROBE UNIVERSITY   (Australia)

Author keywords

Copper; Electroless deposition; Polypyrrole; PTFE; Silanization; ToF SIMS; XPS

Indexed keywords

ARGON; CHEMICAL ACTIVATION; COMPOSITION; CONTACT ANGLE; COPPER; COST BENEFIT ANALYSIS; ELECTROLESS PLATING; ELECTROPOLYMERIZATION; PLASMA APPLICATIONS; POLYPYRROLES; POLYTETRAFLUOROETHYLENES; SECONDARY ION MASS SPECTROMETRY; WATER;

AUTOCATALYTIC REDOX PROCESSES; SILANIZATION;

PLASTIC FILMS;

EID: 0346276975     PISSN: 01422421     EISSN: None     Source Type: Journal    
DOI: 10.1002/sia.1634     Document Type: Article

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