Packaging Design for Implantable Microstimulator

Journal of Medical and Biological Engineering

Volumn 23, Issue 3, 2003, Pages 129-136

  Hung, Chi Chan ^a   Chung, Cho Liang ^b   Young, Gin Shu ^c   Lin, Kang Ping ^c   Chen, Jia Jin ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

BioMEMS; Biomicrosystem; Hermetic packaging; Implantable microstimulator; Polyimide

Indexed keywords

POLYIMIDE; RUBBER; SILICONE; SODIUM CHLORIDE;

ANIMAL EXPERIMENT; ARTICLE; BIOCOMPATIBILITY; DEVICE; ELECTRODE; ELECTROSTIMULATION; ENCAPSULATION; EQUIPMENT DESIGN; FEASIBILITY STUDY; IMPLANTATION; MEDICAL TECHNOLOGY; MICROSTIMULATOR; NERVE STIMULATION; NEUROMODULATION; NEUROMUSCULAR FUNCTION; NONHUMAN; PACKAGING; SCIATIC NERVE; TECHNIQUE;

ANIMALIA; ORYCTOLAGUS CUNICULUS; PHOCIDAE;

EID: 0346102775     PISSN: 16090985     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (18)

1. J. V. Arx, B. Ziaie, M. Dokmeci, and K. Najafi, "Hermeticity Testing Of Glass-silicon Packages With On Chip Feed Throughs," presented at The 8th International Conference on Solid-State Sensors and Actuators, 1995.
2. Y. T. Cheng, L. Lin, and K. Najafi, "Localized bonding with PSG or indium solder as intermediate layer," presented at The 12th IEEE International Conference on Micro Electro Mechanical Systems, 1999.
3. Y. T. Cheng, L. Lin, and K. Najafi, "A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding," Journal of Microelectromechanical Systems, 10: 392-399, 2001.
4. B. Ziaie, J. A. Von Arx, M. R. Dokmeci, and K. Najafi, "A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators," Journal of Microelectromechanical Systems, 5: 166-179, 1996.
5. Y. T. Cheng, L. Lin, and K. Najafi, "Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding," presented at the 13nth Annual International Conference on Micro Electro Mechanical Systems, 2000.
6. T. J. Harpster and K. Najafi, "Long-term testing of hermetic anodically bonded glass-silicon packages," presented at The 15th IEEE International Conference on Micro Electro Mechanical Systems, 2002.
7. B. Ziaie, M. D. Narkin, A. R. Coghlan, and K. Najafi, "A single-channel implantable microstimulator for functional neuromuscular stimulation," IEEE Transactions on Biomedical Engineering, 44: 909-920, 1997.
8. G. E. Loeb, F. J. R. Richmond, W. H. Moore, and R. A. Peck, "Design and fabrication of hermetic microelectronic implants," presented at The 1st Annual International Conference on Microtechnologies in Medicine and Biology, 2000.
9. F. J. R. Richmond, G. E. Loeb, A. C. Dupont, S. D. Bagg, J. L. Creasy, C. Romano, and D. Romano, "Clinical trials of BIONs for therapeutic electrical stimulation," presented at The 23rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2001.
10. J. Singh, R. A. Peck, and G E. Loeb, "Development of BION technology for functional electrical stimulation: hermetic packaging," presented at The 23rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2001.
11. P. R. Troyk, I. E. Brown, W. H. Moore, and G. E. Loeb, "Development of BION technology for functional electrical stimulation: bidirectional telemetry," presented at The 23rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2001.
12. A. C. Dupont, S. D. Bag, L. Baker, S. Chun, J. L. Creasi, C. Romano, D. Romano, R. L. Waters, C. L. Wederich, F. J. R. Richmond, and G E. Loeb, "Therapeutic electrical stimulation with bions: clinical trial report," presented at EMBS/BMES Conference, 2002.
13. H. Beutel, T. Stieglitz, and J. U. Meyer, "Microflex: a new technique for hybrid integration for microsystems," presented at The Eleventh Annual International Workshop on Micro Electro Mechanical Systems, 1998.
14. T. Stieglitz, H. Beutel, R. Keller, M. Schuettler, and J.-U. Meyer, "Flexible, polyimide-based neural interfaces," presented at The Seventh International Conference on Microelectronics for Neural, Fuzzy and Bio-Inspired Systems, 1999.
15. T. Stieglitz, H. Beutel, R. Keller, and J.-U. Meyer, "Integrative design and hybrid assembly of a flexible retina implant system," presented at The First Joint of BMES/EMBS Conference, 1999.
16. T. Stieglitz, M. Schuettler, and J.-U. Meyer, "Micromachined multichannel cuff electrodes for interfacing small nerves," presented at The First Joint of BMES/EMBS Conference, 1999.
17. C. K. Liang, G. S. Yang, J. J. J. Chen and C. K. Chen, "A microcontroller-based implantable stimulation system with wireless power data transmission for animal neuromuscular experiments," Journal of the Chinese Institute of Engineers, 26: 501, 2003.
18. R. R. R. Jr., M. J. A., and R. W.M., "Polyimides as biomaterials: Preliminary biocompatibility testing," Biomaterials, 14: 627-635, 1993.