REAL TIME MONITORING AND SIMULATION OF THERMAL DEFORMATION IN PLASTIC PACKAGE

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1997-V, Issue , 1997, Pages 361-368

  Zhu, Jiansen ^a   Zou, Daqing ^b   Liu, Sheng ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CCD CAMERAS; DEFORMATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERFEROMETRY; PACKAGING; PACKAGING MATERIALS; THERMAL CYCLING;

ELECTRONIC PACKAGING; FRINGE PATTERN; INTERFEROMETRY TECHNIQUE; MOIRE INTERFEROMETRY; REAL TIME MONITORING; REAL- TIME; REALTIME SIMULATION (RTS); THERMAL DEFORMATION; THERMAL-CYCLING; THERMALLY INDUCED;

MOIRE FRINGES;

EID: 0346023916     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1997-1111     Document Type: Conference Paper

References (15)

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