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Volumn 28, Issue 3, 1999, Pages 153-160

Trends in CVD Technology and Equipment for Obtaining Thin Insulating SiO2-Based Films in Microelectronics. Part 2: Narrow Gap Fill

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EID: 0345977059     PISSN: 10637397     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (5)

References (22)
  • 1
    • 0348017074 scopus 로고    scopus 로고
    • 2-Based Films in Microelectronics. Part 1. Materials, Deposition Methods, and Equipment
    • 2-Based Films in Microelectronics. Part 1. Materials, Deposition Methods, and Equipment, Mikroelektronika, 1999, vol. 28, no. 3, pp. 146-153.
    • (1999) Mikroelektronika , vol.28 , Issue.3 , pp. 146-153
    • Vasil'ev, V.Yu.1
  • 2
    • 0001871959 scopus 로고    scopus 로고
    • The SIA's National Technology Roadmap for Semiconductors
    • Gargini, P., Glaze, J., and Williams, O., The SIA's National Technology Roadmap for Semiconductors, Solid State Technol., 1998, vol. 41, no. 1, pp. 73-76.
    • (1998) Solid State Technol. , vol.41 , Issue.1 , pp. 73-76
    • Gargini, P.1    Glaze, J.2    Williams, O.3
  • 3
    • 0010044885 scopus 로고
    • Chemical Vapor Deposition of Amorphous and Polycrystalline Thin Films
    • Wolf, S., Ed., Boston: Lattice
    • Tauber, R., Chemical Vapor Deposition of Amorphous and Polycrystalline Thin Films, Silicon Processing for VLSI Era, Wolf, S., Ed., Boston: Lattice, 1986, vol. 1, pp. 161-197.
    • (1986) Silicon Processing for VLSI Era , vol.1 , pp. 161-197
    • Tauber, R.1
  • 4
    • 0001494663 scopus 로고
    • Dielectric and Polysilicon Film Deposition
    • Sze, S.M., Ed., New York: McGraw-Hill
    • Adams, A.C., Dielectric and Polysilicon Film Deposition, VLSI Technology, Sze, S.M., Ed., New York: McGraw-Hill, 1988, pp. 233-271.
    • (1988) VLSI Technology , pp. 233-271
    • Adams, A.C.1
  • 5
    • 0002178593 scopus 로고
    • Low Pressure Chemical Vapor Deposition
    • Shuegraf, K.K., Ed., New York: Noyes Publications
    • Rossi, R.C., Low Pressure Chemical Vapor Deposition, Handbook of Thin-Film Deposition Processes and Techniques, Shuegraf, K.K., Ed., New York: Noyes Publications, 1988, pp. 80-111.
    • (1988) Handbook of Thin-Film Deposition Processes and Techniques , pp. 80-111
    • Rossi, R.C.1
  • 6
    • 0346749054 scopus 로고    scopus 로고
    • Dielectric and Polysilicon Film Deposition
    • Chang, C. Y. and Cze, S.M., Eds., New York: McGraw-Hill
    • Cheng, H.C., Dielectric and Polysilicon Film Deposition, ULSI Technology, Chang, C. Y. and Cze, S.M., Eds., New York: McGraw-Hill, 1996, pp. 205-269.
    • (1996) ULSI Technology , pp. 205-269
    • Cheng, H.C.1
  • 7
    • 0025483882 scopus 로고
    • Silicon Dioxide Deposition by Atmospheric Pressure and Low-Temperature CVD Using TEOS and Ozone
    • Fujino, K., Nishimoto, Y., Tokumasu, N., and Maeda, K., Silicon Dioxide Deposition by Atmospheric Pressure and Low-Temperature CVD Using TEOS and Ozone, J. Electrochem. Soc., 1990, vol. 137, no. 9, pp. 2883-2887.
    • (1990) J. Electrochem. Soc. , vol.137 , Issue.9 , pp. 2883-2887
    • Fujino, K.1    Nishimoto, Y.2    Tokumasu, N.3    Maeda, K.4
  • 9
    • 0026238564 scopus 로고
    • Doped Silicon Oxide Deposition by Atmospheric Pressure and Low Temperature Chemical Vapor Deposition Using Tetraethoxysilane and Ozone
    • Fujino, K., Nishimoto, Y., Tokumasu, N., and Maeda, K., Doped Silicon Oxide Deposition by Atmospheric Pressure and Low Temperature Chemical Vapor Deposition Using Tetraethoxysilane and Ozone, J. Electrochem. Soc., 1991, vol. 138, no. 10, pp. 3019-3024.
    • (1991) J. Electrochem. Soc. , vol.138 , Issue.10 , pp. 3019-3024
    • Fujino, K.1    Nishimoto, Y.2    Tokumasu, N.3    Maeda, K.4
  • 10
    • 0030130377 scopus 로고    scopus 로고
    • Gap Fill and Film Reflow Capability of Sub-atmospheric Chemical Vapor Deposited Borophosphosilicate Glass
    • Robles, S., Russel, K., Galiano, M., Kithcart, V., and Nguen, B.C., Gap Fill and Film Reflow Capability of Sub-atmospheric Chemical Vapor Deposited Borophosphosilicate Glass, J. Electrochem. Soc., 1996, vol. 143, no. 4, pp. 1414-1421.
    • (1996) J. Electrochem. Soc. , vol.143 , Issue.4 , pp. 1414-1421
    • Robles, S.1    Russel, K.2    Galiano, M.3    Kithcart, V.4    Nguen, B.C.5
  • 11
    • 1842628590 scopus 로고    scopus 로고
    • The Investigation on the Deposition Kinetics of Sub-atmospheric Pressure Glass Films
    • Singapore
    • Vassiliev, V.Y. and Zheng, J.Z., The Investigation on the Deposition Kinetics of Sub-atmospheric Pressure Glass Films, Proc. 7th Int. Symp. IC Technology, Singapore, 1997, pp. 522-525.
    • (1997) Proc. 7th Int. Symp. IC Technology , pp. 522-525
    • Vassiliev, V.Y.1    Zheng, J.Z.2
  • 12
    • 0027676874 scopus 로고
    • TEOS and Ozone Atmospheric Pressure CDV of Borophosphosilicate Glass Films Using Triethylborate and Trimethylphosphate
    • Fujino, K., Nishimoto, Y., Tokumasu, N., and Maeda, K., TEOS and Ozone Atmospheric Pressure CDV of Borophosphosilicate Glass Films Using Triethylborate and Trimethylphosphate, J. Electrochem. Soc., 1993, vol. 140, no. 10, pp. 2922-2927.
    • (1993) J. Electrochem. Soc. , vol.140 , Issue.10 , pp. 2922-2927
    • Fujino, K.1    Nishimoto, Y.2    Tokumasu, N.3    Maeda, K.4
  • 13
    • 0002220825 scopus 로고    scopus 로고
    • Step Coverage and Gap-Fill Properties of Sub-atmospheric and Atmospheric Pressure TEOS-Ozone Borophosphosilicate Glass Films
    • Santa Clara (USA)
    • Vassiliev, V.Y., Zheng, J.Z., Liao, M., and Lin, Y.S., Step Coverage and Gap-Fill Properties of Sub-atmospheric and Atmospheric Pressure TEOS-Ozone Borophosphosilicate Glass Films, Proc. 4th Int. Dielectric for ULSI Multilevel Interconnection Conf., Santa Clara (USA), 1998, pp. 90-97.
    • (1998) Proc. 4th Int. Dielectric for ULSI Multilevel Interconnection Conf. , pp. 90-97
    • Vassiliev, V.Y.1    Zheng, J.Z.2    Liao, M.3    Lin, Y.S.4
  • 16
    • 0002905861 scopus 로고
    • Deposition, Properties, and Application of Borophosphosilicate Glass Layers in IC Technology
    • Dukhanova, T.G., Vasil'ev, V.Yu., and Veretenin, Yu.I., Deposition, Properties, and Application of Borophosphosilicate Glass Layers in IC Technology, Obz. Elektron. Tekh., Ser. 3, 1988, no. 4, pp. 1-72.
    • (1988) Obz. Elektron. Tekh., Ser. 3 , Issue.4 , pp. 1-72
    • Dukhanova, T.G.1    Vasil'ev, V.Yu.2    Veretenin, Yu.I.3
  • 17
    • 0346118486 scopus 로고
    • Models and Mechanisms of LPCVD of Thin Films
    • Vasil'ev, V.Yu., Models and Mechanisms of LPCVD of Thin Films, Obz. Elektron. Tekh., Ser. 2, 1990, no. 3, pp. 1-56.
    • (1990) Obz. Elektron. Tekh., Ser. 2 , Issue.3 , pp. 1-56
    • Vasil'ev, V.Yu.1
  • 18
    • 0346749051 scopus 로고
    • CVD of Silicon Nitride and Silicon Dioxide from Monosilane Derivatives
    • Novosibirsk
    • Vasil'ev, V.Yu., CVD of Silicon Nitride and Silicon Dioxide from Monosilane Derivatives, Cand. Sci. (Chem.) Dissertation, Novosibirsk, 1990.
    • (1990) Cand. Sci. (Chem.) Dissertation
    • Vasil'ev, V.Yu.1
  • 19
    • 0348009885 scopus 로고
    • CVD Equipment
    • Vasil'ev, V.Yu., CVD Equipment, Khim. Fiz., 1992, vol. 11, no. 10, pp. 1406-1413.
    • (1992) Khim. Fiz. , vol.11 , Issue.10 , pp. 1406-1413
    • Vasil'ev, V.Yu.1
  • 20
    • 1842679056 scopus 로고    scopus 로고
    • A Comparative Study of TEOS-Based Chemical Vapor Deposition Techniques for Shallow Trench Isolation Technology
    • Singapore
    • Sudijono, J.L., Vassiliev, V.Y., and Zheng, J.Z., A Comparative Study of TEOS-Based Chemical Vapor Deposition Techniques for Shallow Trench Isolation Technology, Proc. 7th Int. Symp. IC Technology, 1997, Singapore, pp. 597-600.
    • (1997) Proc. 7th Int. Symp. IC Technology , pp. 597-600
    • Sudijono, J.L.1    Vassiliev, V.Y.2    Zheng, J.Z.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.