Random change of vibration modes in thermosonic bonding

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 3, 1998, Pages 253-258

  Kang, S Y ^a,b   Chuang, K ^a   Lee, Y C ^a  

^a UCB 450   (United States)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; FREQUENCY RESPONSE; MATHEMATICAL MODELS; PERFORMANCE; TAPES; ULTRASONICS; VIBRATIONS (MECHANICAL); WIRE;

THERMOSONIC BONDING;

BONDING;

EID: 0032167105     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792630     Document Type: Article

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