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Volumn 28, Issue 23, 2003, Pages 2327-2329

Thermal stresses in optical waveguides

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; BIREFRINGENCE; CLADDING (COATING); COMPUTER SIMULATION; ELASTIC MODULI; FINITE ELEMENT METHOD; LIGHT PROPAGATION; OPTICAL SYSTEMS; SOLUTIONS; THERMAL EXPANSION; THERMAL STRESS;

EID: 0345446017     PISSN: 01469592     EISSN: None     Source Type: Journal    
DOI: 10.1364/OL.28.002327     Document Type: Article
Times cited : (23)

References (9)
  • 8
    • 0038624172 scopus 로고    scopus 로고
    • Underfill selection and its impact on the reliability of flip chip assembles
    • Kokomo, Ind., March
    • X. Yan, "Underfill selection and its impact on the reliability of flip chip assembles," presented at the Delphi Automotive Systems Analytical Design Forum, Kokomo, Ind., March, 1999.
    • (1999) Delphi Automotive Systems Analytical Design Forum
    • Yan, X.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.