Thermal strain analysis in optical planar waveguides

IEEE Photonics Technology Letters

Volumn 15, Issue 3, 2003, Pages 398-400

  Zhao, Xiuli ^a,b   Xu, Y Z ^c   Li, Chunfei ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b WUHAN RESEARCH INSTITUTE OF POSTS AND TELECOMMUNICATIONS   (China)

^c Accelink Technologies Co Ltd   (China)

Author keywords

Birefringence; Multilevel systems; Optical planar waveguides; Strain; Stress; Thin films

Indexed keywords

BIREFRINGENCE; CLADDING (COATING); ELASTIC MODULI; MULTILAYERS; OPTICAL COMMUNICATION; POISSON RATIO; THERMAL LOAD; THERMAL STRESS; THIN FILMS;

PLANAR LIGHTWAVE CIRCUITS (PLC);

OPTICAL WAVEGUIDES;

EID: 0037340898     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2002.807924     Document Type: Article

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