Large deflection of thin plates under certain mixed boundary conditions - cylindrical bending

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 53-58

  Xue, Yibin ^a   Jairazbhoy, Vivek A ^b   Niu, Xiaoting ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b VISTEON CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BOUNDARY CONDITIONS; COMPUTER SIMULATION; ELASTIC MODULI; FINITE ELEMENT METHOD; FUNCTIONS; RIGIDITY; STRAIN; SURFACES;

AXIAL STRAIN; CYLINDRICAL BENDING; ELLIPTICAL FUNCTIONS; SOFTWARE PACKAGE ABAQUS; THIN PLATE THEORY;

ELECTRONICS PACKAGING;

EID: 0344982111     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1527892     Document Type: Article

References (7)

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