Development of flex stackable carriers

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 378-384

  Isaak, Harlan ^a   Uka, Pete ^a  

^a Dense Pac Microsystems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; ETCHING; FLIP CHIP DEVICES; INTEGRATED CIRCUITS;

BALL GRID ARRAY; FLEX STACKABLE CARRIERS;

CHIP SCALE PACKAGES;

EID: 0034479564     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)