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Volumn 37, Issue 5, 1997, Pages
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Flex circuit materials meet application requirements
a
a
NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
CONDUCTIVE MATERIALS;
DIELECTRIC FILMS;
ELECTRIC INSULATION;
POLYESTERS;
POLYIMIDES;
PRINTED CIRCUIT MANUFACTURE;
PROTECTIVE COATINGS;
SCREEN PRINTING;
THERMAL CONDUCTIVITY;
FLEXIBLE CIRCUITS;
POLYETHYLENE NAPHTHALATE;
POLYIMIDE FILMS;
PRINTED CIRCUIT BOARDS;
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EID: 0031120733
PISSN: 00134945
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (3)
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References (1)
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