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Volumn 10, Issue 1, 1998, Pages 32-36
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Surface mount assembly of BGA and μBGA
a
a
SIEMENS AG
(Germany)
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Author keywords
Ball grid array; Chip size package; Printed circuit board; Surface mount assembly
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Indexed keywords
ASSEMBLY;
CHIP SCALE PACKAGES;
FLIP CHIP DEVICES;
INSPECTION;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT MANUFACTURE;
PRINTED CIRCUIT TESTING;
SCREEN PRINTING;
SOLDERING;
BALL GRID ARRAYS (BGA);
FEASIBILITY STUDY;
QUADFLATPACKS (QFP);
WAVE SOLDERING;
SURFACE MOUNT TECHNOLOGY;
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EID: 84993082505
PISSN: 09540911
EISSN: None
Source Type: Journal
DOI: 10.1108/09540919810203838 Document Type: Review |
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Times cited : (2)
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References (0)
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