Understanding the Dishing Difference between a Line and a Bond Pad in Cu CMP

Electrochemical and Solid-State Letters

Volumn 6, Issue 12, 2003, Pages

  Fu, Guanghui ^a   Li, Hugh ^b   Wei, David ^a  

^a LAM RESEARCH CORPORATION   (United States)

^b ROHM AND HAAS COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; DEFORMATION; DIELECTRIC LOSSES; ELASTIC MODULI; ORDINARY DIFFERENTIAL EQUATIONS; PARTIAL DIFFERENTIAL EQUATIONS; POLYURETHANES;

AIRFLOW; BOND PAD;

CHEMICAL MECHANICAL POLISHING;

EID: 0344945596     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1623371     Document Type: Article

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