Novel method and device for solder joint quality inspection by using laser ultrasound

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 408-415

  Liu, Sheng ^a   Erdahl, Dathan ^a   Ume, I Charles ^a   Achari, Achyuta ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FLIP CHIP DEVICES; INSPECTION; INTERFEROMETERS; PULSED LASER APPLICATIONS; SOLDERING; THERMOELASTICITY;

BALL GRID ARRAY; LASER ULTRASOUND; SOLDER JOINT; VIBRATION MOTION;

SURFACE MOUNT TECHNOLOGY;

EID: 0034476774     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)