On the life prediction and accelerated testing of solder joints

American Society of Mechanical Engineers, EEP

Volumn 24, Issue , 1998, Pages 1-11

  Qian, Zhengfang ^a   Liu, Sheng ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; THERMAL EFFECTS;

ACCELERATED TESTING; THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 0032321032     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (38)