Surface mount technology - capabilities and requirements

IEEE Aerospace Applications Conference Proceedings

Volumn 4, Issue , 1997, Pages 285-291

  Bjorndahl, William D ^a   Selk, Ken ^a   Chen, Wennei ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVIONICS; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; RELIABILITY; SPACE APPLICATIONS; THERMAL CYCLING;

GEOSYNCHRONOUS EARTH ORBIT (GEO) MISSIONS; HIGH DENSITY SURFACE MOUNT PACKAGES; LOW EARTH ORBIT (LEO) MISSIONS;

SURFACE MOUNT TECHNOLOGY;

EID: 0030781595     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)