Thermal grain boundary grooving with anisotropic surface free energies

Acta Materialia

Volumn 52, Issue 1, 2004, Pages 107-116

  Zhang, W ^a   Sachenko, P ^b   Gladwell, I ^c  

^a OAKLAND UNIVERSITY   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

^c SOUTHERN METHODIST UNIVERSITY   (United States)

Author keywords

Annealing; Modeling; Simulation; Surface diffusion; Surface energy

Indexed keywords

ANISOTROPY; ANNEALING; COMPUTER SIMULATION; DIFFUSION; FREE ENERGY; GRAIN BOUNDARIES; MATHEMATICAL MODELS; TUNGSTEN;

SURFACE DIFFUSION;

INTERFACIAL ENERGY;

EID: 0344011641     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2003.08.033     Document Type: Article

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