Low-temperature quartz-to-silicon bonding for SAW applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3328, Issue , 1998, Pages 81-85

  Berthold, Axel ^a   Sarro, Pasqualina M ^a   Vellekoop, Michael J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Low temperature bonding; Micro acoustic wave detector; Quartz to silicon bonding

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ACOUSTIC TRANSDUCERS; ACOUSTIC WAVES; ACOUSTICS; ALUMINA; ALUMINUM COMPOUNDS; ALUMINUM NITRIDE; BONDING; CONCRETE BRIDGES; ELASTIC WAVES; INTELLIGENT STRUCTURES; MEMS; MICROELECTROMECHANICAL DEVICES; NITRIDES; NONMETALS; OXIDE FILMS; OXIDE MINERALS; PIEZOELECTRIC MATERIALS; PIEZOELECTRIC TRANSDUCERS; PIEZOELECTRICITY; QUARTZ; SENSORS; SILICON WAFERS; THIN FILMS; ZINC; ZINC OXIDE;

ALUMINUM NITRIDE (AIN TIN); BOND STRENGTHS; CHEMICAL TREATMENTS; LOW TEMPERATURE BONDING; MICRO ACOUSTIC WAVE DETECTOR; NEW PROCESSES; QUARTZ-TO-SILICON BONDING; REPRODUCIBILITY; ROOM-TEMPERATURE (RT); SENSOR APPLICATIONS;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 0342689029     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.320200     Document Type: Conference Paper

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