Properties of SiO2 and Si3N4 layers deposited by MF twin magnetron sputtering using different target materials

Thin Solid Films

Volumn 351, Issue 1-2, 1999, Pages 158-163

  Ruske, M ^a   Brauer G ^a   Pistner, J ^a   Szczyrbowski, J ^a   Weigert, M ^a  

^a EVONIK INDUSTRIES AG   (Germany)

Author keywords

Optical coatings; Silicon nitride; Silicon oxide; Sputter targets; Sputtering

Indexed keywords

BORON; DOPING (ADDITIVES); INDUSTRIAL APPLICATIONS; MAGNETRON SPUTTERING; OPTICAL COATINGS; POLYCRYSTALLINE MATERIALS; SILICON ALLOYS; SPUTTER DEPOSITION;

SILICON ALUMINUM ALLOY; SPUTTER CHAMBER; SPUTTER TARGETS;

SILICON COMPOUNDS;

EID: 0342468922     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(99)00157-1     Document Type: Article

References (8)

1. G. Bräuer, J. Szczyrbowski, G. Teschner, J. Non-Cryst. Solids 218 (1997) 19.
2. J. Szczyrbowski, G. Teschner, Soc. Vac. Coaters, Proc. 38th Annu. Tech. Conf. (1995) 389.
3. M. Ruske, G. Bräuer, J. Pistner, J. Szczyrbowski, A. Zmelty, Mater. Sci. Forum 287/288 (1998) 247.
4. D. Beisenherz, G. Bräuer, J. Szczyrbowski, G. Teschner, Proc. Glass Processing Days, Tampere (1997) 309.
5. H. Schilling, G. Bräuer, M. Ruske, J. Szczyrbowski, Proc. Glass Processing Days, Tampere (1997) 203.
6. P. Wirz, German Patent DE, 3,566,274.3 (1984).
7. M. Weigert, U. Konietzka, LEYBOLD MATERIALS GmbH, Hanau, Germany, patent pending.
8. A.C. Adams, Plasma Deposited Thin Films, CRC Press, Boca Raton, FL, 1986, 129.