microDAC deformation analysis on solder interconnects for flip chip

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Vogel, Dietmar ^a   Luczak, Falk ^a   Schubert, Andreas ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; DEFORMATION; EPOXY RESINS; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; OPTICAL MICROSCOPY; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; STRAIN; THERMAL CYCLING;

DEFORMATION MEASUREMENT;

ELECTRONICS PACKAGING;

EID: 0342297936     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Han, B., Gou, Y., 1995, Thermal deformation analysis of various electronic packaging products by Moiré interferometry, J. of Electronic Packaging, Vol. 117, September, pp.185-191.
2. Lau, J. H., 1996, Flip Chip Technologies, McGraw-Hill, N.Y.
3. Michel, B., Schubert, A., Dudek, R., Grosser, V., 1994, Experimental and numerical investigations of thermo-mechanically stressed micro components", Microsystem Technologies, Vol. 1, No.1, pp. 14-22.
4. Michel; B., 1997, Fracture electronics - concepts of fracture mechanics for reliability estimation in microelectronics and microsystem technology, Proc. of Micro Materials '97 Conference, ddp Goldenbogen, Berlin, pp. 382-389.
5. Michel, B., Vogel, D., Grosser, V., 1998, Mechanical Properties of Microsystem Components, Laser Interferometry IX: Applications, San Diego, Proc. of SPIE, Vol. 3479, pp. 140-151.
6. Post, D., Han, B., Ifju, P., 1994, Thermal deformations in electronic packaging in "High Sensitivity Moiré", Springer-Verlag, N.Y., 331-347.
7. th European Solid-State Device Research Conf., Bordeaux.
8. Uhlig, C., Kahle, O., Vogel, D., Bauer, M., 1997, The application of thermophysical methods in microsystems and microelectronics, Proc. of Micro Materials '97, Berlin, pp. 1097-1099.
9. Vogel, D., Schubert, A., Faust, W., Dudek, R., Michel, B., 1996, MicroDAC - A novel approach to measure in situ deformation fields of microscopic scale, Microelectronics Reliability, Vol. 36, No. 11/12, pp. 1339-1342.
10. Vogel, D., Auersperg, J., Schubert, A., Michel, B., Reichl, H, 1997, Deformation analysis on flip chip solder interconnects by microDAC, Proc. of Reliability of Solders and Solder Joints Symposium at 126th TMS Annual Meeting & Exhibition, Orlando, USA, in "Design & Reliability of Solders and Solder Interconnects", ed. by R.K. Mahidhara, TMS Publication Cat. No. 96-80433, pp. 429-438.
11. rd Int. Symp. on Electronic Packaging Technology (ISEPT '98), Beijing.