Active Matrix OLED Using 150°C a-Si TFT Backplane Built on Flexible Plastic Substrate

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5080, Issue , 2003, Pages 180-191

  Sarma, K R ^a   Chanley, C ^a   Dodd, S ^a   Roush, J ^a   Schmidt, J ^a   Srdanov, G ^b   Stevenson, M ^b   Wessel, R ^b   Innocenzo, J ^b   Yu, G ^b   O'Regan, M ^b   MacDonald, W A ^b   Eveson, R ^b   Long, K ^c   Gleskova, H ^c   Wagner, S ^c   Sturm, J C ^c  

^a HONEYWELL   (United States)

^b DUPONT COMPANY   (United States)

^c Princeton University   (United States)

Author keywords

150 C a Si TFT; AM OLED; Flexible Active Matrix OLED; Flexible AM OLED; Flexible Display; Flexible TFT OLED; Organic Light Emitting Diode; Plastic Dimensional Stability; Plastic Display; Plastic Substrate

Indexed keywords

FABRICATION; FLEXIBLE STRUCTURES; LEAKAGE CURRENTS; LIGHT EMITTING DIODES; LIQUID CRYSTAL DISPLAYS; LOW TEMPERATURE EFFECTS; MICROPROCESSOR CHIPS;

PLASTIC DISPLAY;

THIN FILM TRANSISTORS;

EID: 0242719993     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.497638     Document Type: Conference Paper

References (14)

1. Flexible Microelectronics and Displays Conference, USDC Conf. Proc., February 3-4, 2003, Phoenix, Arizona.
2. T. Tsujimura, K. Murayama, A. Tanaka, M. Morooka, Y. Kobayashi, C-T. Chung, R-M. Chen, C-C. Yang, W. Reiss, F.R. Libsch, A 20-in OLED display driven by Super-a-Si Technology, p, SID Digest 2003
3. K. R. Sarma, Prospects for the development of AM OLEDs for cockpit display applications, Cockpit Displays IX, Displays for Defense Applications, Ed. D. G. Hopper, Proceedings of the SPIE Vol. 4712 (2002), p 250-261
4. J. C. Sturm, H. Gleskova, T. N. Jackson, S. J. Fonash, S. Wagner, Enabling technologies for flexible displays, ibid. p 222-236
5. th Annual Technical Conference Proceedings of the Society of Vacuum Coaters, 482, (2002)
6. Teonex® is registered trademark of Teijin DuPont Films Japan Limited and licensed to DuPont Teijin Films U.S. Limited Partnership.
7. MacDonald, W.A. and Mackerron, D.H., in "PET Packaging Technology", D W Brooks, G. A. Giles Eds, CRC Press, Sheffield (2002)
8. Barix™, Vitex Systems Inc., 3047 Orchard Parkway, San Jose, CA 95134
9. Y. Lee, S. Bae, S. Fonash, Extended Abstracts, Electrochemical Society Meeting, 2000-2, 791 (2000)
10. S. Utsunomiya, S. Inoue, T. Shimoda, Low-temperature poly-silicon TFTs on plastic substrate using surface free technology by laser ablation / annealing (SUFTLA™), p 916-919, SID Digest 2000.
11. M. Ohkura, S. Shimomura, T. Miyazawa, T. Itoga, T. Shiba, 450 C Low-temperature poly-silicon TFT fabrication process applicable the display manufacturing using 730×920 mm2 glass substrates, p 146-149, SID Digest 2002.
12. P. Wickbolt, P. Smith, F. Lemmi, T. Sasagawa, S. Lin, Progress on ultra-low temperature polysilicon (ULTPS) fabrication, in Ref. [1]
13. H. Gleskova, S. Wagner, Z. Suo, "a-Si:H TFTs Made on Polyimide Foil by PECVD at 150C", in Flat Panel Display Materials - 1998 (Eds. G.N. Parsons, C.C. Tsai, T.S. Fahlen, and C.H. Seager), Mat. Res. Soc. Symp. Proc. 508 (1998), pp. 73-78
14. D. J. Gundlach, H. Klauk, C. D. Sheraw, C.C. Kuo, J. R. Hung, T. Jackson, 1999 International Electron Devices Meeting Technical Digest, 249 (1999)