Curing kinetics and thermal property characterization of bisphenol-F epoxy resin and MeTHPA system

Journal of Thermal Analysis and Calorimetry

Volumn 74, Issue 1, 2003, Pages 227-236

  Zhao, H ^a,b   Gao, J ^a   Li, Y ^a   Shen, S ^a  

^a HEBEI UNIVERSITY   (China)

^b Baoding Teachers College   (China)

Author keywords

3 methyl 1,2,3,6 tetrahydrophthalic anhydride; Bisphenol F epoxy resin; Glass transition temperature; Kinetics; Thermal degradation

Indexed keywords

AGENTS; CHARACTERIZATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; EPOXY RESINS; EQUATIONS OF STATE; GLASS TRANSITION; MATHEMATICAL MODELS; PYROLYSIS; REACTION KINETICS; THERMOGRAVIMETRIC ANALYSIS;

BISPHENOL-F EPOXY RESIN; CURING KINETICS; DIMETHYLBENZYLAMINE; METHYLTETRAHYDROPHTHALIC ANHYDRIDE; THERMAL DEGRADATION KINETICS; THERMAL PROPERTY CHARACTERIZATION; TORSIONAL BRAID ANALYSIS;

THERMODYNAMIC PROPERTIES;

EID: 0242695664     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1026346323733     Document Type: Article

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