A new curing kinetic model and its application to BPSER/DDM epoxy system

Journal of Thermal Analysis and Calorimetry

Volumn 65, Issue 3, 2001, Pages 837-846

  Liu, G ^a   Zhang, L ^a   Qu, X ^a   Li, Y ^b   Gao, J ^b   Yang, L ^b  

^a HEBEI UNIVERSITY OF TECHNOLOGY   (China)

^b HEBEI UNIVERSITY   (China)

Author keywords

4,4 diaminodiphenylmethane; Bisphenol S epoxy resin; Cure reaction; Differential scanning calorimetry; Kinetics model

Indexed keywords

ACTIVATION ENERGY; CATALYSIS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; EPOXY RESINS;

AUTOCATALYTIC REACTIONS;

REACTION KINETICS;

EID: 0034803620     PISSN: 14182874     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1011984317337     Document Type: Article

References (18)