DSC and FTIR analyses of the curing behavior of epoxy/dicy/solvent systems on hermetic specimens

Journal of Thermal Analysis and Calorimetry

Volumn 59, Issue 3, 2000, Pages 711-719

  Hong, S G ^a   Wu, C S ^a  

^a YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; EVAPORATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS TRANSITION; REACTION KINETICS; SOLVENTS; TEMPERATURE; THERMAL EFFECTS;

DICYANDIAMIDE; HERMETIC;

CURING;

EID: 0033740732     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (33)

1. E. Sacher, Polymer, 14 (1973) 91.
2. S. Muroi, H. Ishimura and M. Outsuka, J. Appl. Polym. Sci., 32 (1986) 5095.
3. R. L. Miller and M. A. Oebser, Thermochim. Acta, 36 (1980) 121.
4. P. N. Son and C. D. Weber, J. Appl.. Polym. Sci., 17 (1973) 1305.
5. J. M. Barton and D. C. Greenfield, Brit. Polym. J., 18 (1986) 196.
6. Y. G. Lin, H. Sautereau and J. P. Pascault, J. Polym. Sci., Part A, 24 (1986) 2171.
7. T. Guthner and B. Hammer, J. Appl. Polym. Sci., 50 (1993) 1453.
8. M.-F. Grenier-Loustalot, M.-P. Bente and P. Grenier, Eur. Polym. J., 27 (1991) 1201.
9. M. D. Gilbert, N. S. Schneider and W. J. MacKnight, Macromolecules, 24 (1991) 360.
10. M. Opresnik, A. Sebenik, M. Zigon and U. Osredkar, Thermochim. Acta, 178 (1991) 127.
11. S. G. Hong and T. C. Wang, Thermochim. Acta, 237 (1994) 305.
12. S. G. Hong and J. J. Lin, J. Appl. Polym. Sci., 59 (1996) 1597.
13. R. O. Cater III, R. A. Dickie, J. W. Holubka and N. E. Lindsay, Ind. Eng. Chem. Res., 28 (1989) 48.
14. R. O. Cater III, R. A. Dickie and J. W. Holubka, Polym. Mat. Sci. Eng., 58 (1988) 55.
15. W. Brockmann, O. D. Hennemann, H. Kollek and C. Matz, Int. J. Adhes. Adhesives, 6 (1986) 115.
16. F. J. Boerio and P. P. Hong, Mat. Sci. Eng., A126 (1990) 245.
17. G. L. Hagnauer and D. A. Dunn, J. Appl. Polym. Sci., 26 (1981) 1837.
18. H. Inoue, H. Fukke, M. Katsumoto and K. Konno, J. Colloid Interface Sci., 138 (1990) 92.
19. M. Shimbo, M. Ochi and K. Arai, J. Coating Technol., 57 (1985) 93.
20. S. G. Croll, J. Coating Technol., 51 (1979) 49.
21. S. G. Croll, J. Coating Technol., 53 (1981) 85.
22. S. G. Hong and C. S. Wu, Thermochim. Acta, in press, 1998.
23. R. A. Fava, Polymer, 9 (1968) 137.
24. G. L. Hagnauer and D. A. Dunn, J. Appl. Polym. Sci., 26 (1981) 1837.
25. B. C. Ennis, R. G. Davidson, P. J. Pearce and C. E. M. Morris, J. Adhesion, 37 (1992) 131.
26. T. F. Saunders, M. F. Levy and J. F. Serino, J. Polym. Sci., Part A-1, 5 (1967) 1609.
27. P. Peyser and W. D. Bascom, J. Appl. Polym. Sci., 21 (1977) 2359.
28. Y. G. Lin, H. Sautereau and J. P. Pascault, J. Polym. Sci., Part A, 24 (1986) 2171.
29. M. D. Gilbert, N. S. Schneider and W. J. MacKnight, Macromolecules, 24 (1991) 360.
30. P. Eyerer, J. Appl. Polym. Sci., 15 (1971) 3067.
31. H. H. Levine, Polym. Preprint, 41 (1964) 8.
32. R. O. Cater III, R. A. Dickie, J. W. Holubka and N. E. Lindsay, Ind. Eng. Chem. Res., 28 (1989) 48.
33. W. J. Jones and W. J. Orville-Thomas, Trans. Faraday Soc., 55 (1959) 193.