Stress reduction experiments during constant-strain-rate tests in Cu and Ge

Philosophical Magazine Letters

Volumn 83, Issue 11, 2003, Pages 651-658

  Kruml, T ^a,c   Coddet, O ^a   Saada, G ^b   Martin, J L ^a  

^a EPFL   (Switzerland)

^b CNRS   (France)

^c INSTITUT JEAN LAMOUR   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ANELASTIC RELAXATION; COPPER; CREEP TESTING; LIGHT REFLECTION; MICROSTRUCTURE; PLASTIC DEFORMATION; SINGLE CRYSTALS; STRAIN RATE; STRESSES;

STRESS REDUCTION;

GERMANIUM;

EID: 0242693113     PISSN: 09500839     EISSN: None     Source Type: Journal    
DOI: 10.1080/09500830310001612092     Document Type: Article

References (9)

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