Insulation technology for medium voltage solid insulated switchgear

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report

Volumn , Issue , 2003, Pages 341-344

  Shioiri, Tetsu ^a   Sato, J ^a   Ozaki, T ^a   Sakaguchi, O ^a   Kamikawaji, T ^a   Miyagawa, M ^a   Homma, M ^a   Suzuki, K ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EMISSIONS; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRIC CIRCUIT BREAKERS; ELECTRIC INSULATION; PARTIAL DISCHARGES; WEIBULL DISTRIBUTION;

MOLDED ELECTRODES;

ELECTRIC SWITCHGEAR;

EID: 0242664807     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. N. Masaki, T. Yoshida, and K. Kato, "Compact 66/77kv C-GIS That Meets Space-Saving Requirements," Toshiba review, vol. 52, No. 9, pp. 59-62, 1997.
2. J. Sato, O. Sakaguchi, N. Kubota, S. Makishima, S. Kinoshita, T. Shioiri, T. Yoshida, M. Miyagawa, M. Homma, and E. Kaneko, "New Technology for Medium Voltage Solid Insulated Switchgear" IEEE/PES T&D Conference 2002, pp. 1791-1796, 2002
3. T.Shimizu, S.Kinoshita, S.Makishima, J.Sato and O.Sakaguchi, "Material and Simulation Technology for Solid Insulated Switchgear", Proc. of 2003 ICPAD 2003, R-327
4. M.Honda, H.Aoyagi, M.Koya, N.Kobayashi, M.Tamura, "V-T characteristics of epoxy mold insulation for sustained AC voltage", IEEE PES Summer Meeting, 83 SM 261-3, 1983
5. T.Shioiri, K.Sasage, T.Kamikawaji, M.Homma and E.Kaneko, "Investigation of Dielectric Breakdown Probability Distribution for Vacuum Disconnecting switch", IEEE/PES T&D Conference 2002, pp.1780-1785, 2002