Characterization and Reduction of Copper Chemical Mechanical Polishing Induced Scratches

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5041, Issue , 2003, Pages 61-69

  Teo, Tai Yong ^a   Goh, Wang Ling ^a   Leong, Lup San ^b   Lim, Victor Seng Keong ^b   Tse, Tak Yan ^b   Chan, Lap ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

Abrasives; Alumina; Chemical mechanical polishing; Copper; Defects; Microscratches; Scratches; Silica; Slurry

Indexed keywords

ABRASIVES; AGGLOMERATION; ALUMINA; COPPER; DEFECTS; EROSION;

MICROSCRATCHES;

CHEMICAL MECHANICAL POLISHING;

EID: 0242524674     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.485223     Document Type: Conference Paper

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