The effects of strain rate and thickness on the response of thin layers of solder loaded in pure shear

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 2, 1997, Pages 81-84

  Gilat, A ^a   Krishna, K ^a  

^a Ohio State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; MECHANICAL TESTING; PLASTIC DEFORMATION; SHEAR DEFORMATION; SHEAR STRESS; STRAIN RATE; STRESS ANALYSIS; TIN ALLOYS;

MECHANICAL RESPONSE; STRESS STRAIN CURVE; THICKNESS EFFECTS; THIN LAYERS;

SOLDERING ALLOYS;

EID: 0031162038     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792223     Document Type: Article

References (5)

1. Adams, P. J., 1986, “Thermal Fatigue of Solder Joints in Micro-Electronic Devices,” MSc Thesis, Massachusetts Institute of Technology, Boston, MA
2. Enke, N. F., Kilinski, T. J., Schroeder, S. A., and Lesniak, J. R., 1989, “Mechanical Behaviors of 60/40 Tin-Lead Solder Lap Joints,” IEEE Transactions on Components Hybrids and Manufacturing Technology, Vol. 12, pp. 459-468.
3. Hawkins, S. P., Thwaites, C. J., Warwick, M. E., 1986, “Mechanical Properties of Soldered Joints to Surface Mounted Devices,” Brazing and Soldering, No. 10, pp. 4-6.
4. Guo, Z., Sprecher, A. F., and Conrad, H., 1991, “Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue,” ASME WAM Symposium Mechanics of Surface Mount Assemblies, Atlanta, GA, Dec. 3-4, ASME, New York, NY.
5. Stone, K. R., Duckett, R., Muckett, S., and Warwick, M., 1983, “Mechanical Properties of Solders and Soldered Joints,” Brazing and Soldering, No. 4, pp. 20-27