Rotating Cylindrical Magnetron Sputtering: Aspects Influencing the Sputter Deposition Yield in Large Area Coating Applications

Proceedings, Annual Technical Conference - Society of Vacuum Coaters

Volumn , Issue , 2003, Pages 248-252

  Blondeel, A ^a   De Bosscher, W ^a  

^a Bekaert sa   (Belgium)

Author keywords

Cylindrical sputtering targets; Film thickness; Reactive deposition; Sputter deposition

Indexed keywords

COATINGS; POSITIVE IONS; SPUTTER DEPOSITION;

COATER GEOMETRY;

MAGNETRON SPUTTERING;

EID: 0242290779     PISSN: 07375921     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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2. G. Este, W.D. Westwood, "A Quasi-Direct-Current Sputtering Technique for the Deposition of dielectrics at enhanced rates," J. Vac. Sci. Technol., A6(3), 1845, 1988.
3. W. De Bosscher, D. Cnockaert, and H. Lievens, "Advances in cylindrical magnetrons," 42nd Annual Technical Conference Proceedings of the Society of Vacuum Coaters, p. 156, 1999.
4. C.K. Carniglia, "Method for calculating the sputter distribution for a C-mag, cylindrical target in the presence of gas scattering," 39th Annual Technical Conference Proceedings of the Society of Vacuum Coaters, p. 211, 1996.
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7. Qi Hua Fan, Li Qin Zhou, J.J. Gracia, "A cross-corner effect in a rectangular sputtering magnetron", J. Phys. D: Appl. Phys. 36, 244, 2003.
8. P. Sieck, "Effect of anode location on deposition profiles for long rotatable magnetrons," 37th Annual Technical Conference Proceedings of the Society of Vacuum Coaters, p. 233, 1994.
9. P.A. Sieck, U.S. Pat. #5,645,699, "Dual cylindrical target with multiple anodes," Jul. 8, 1997.