Heat Transfer and Residual Stress Modeling of a Diamond Film Heat Sink for High Power Laser Diodes

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 575-581

  Labudovic, Marko ^a   Burka, Michael ^a  

^a Corning Laserton Inc ^*  (United States)

Author keywords

Diamond; Finite element model; Heat transfer; Laser diode; Residual stress; Telecommunication

Indexed keywords

DIAMOND FILMS; FINITE ELEMENT METHOD; HEAT SINKS; HEAT TRANSFER; RESIDUAL STRESSES; SEMICONDUCTING GALLIUM ARSENIDE;

CAVITY LENGTHS;

SEMICONDUCTOR LASERS;

EID: 0142258100     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817649     Document Type: Article

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