Planarization of large area CVD-diamond films using polyimide

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 3, 1996, Pages 316-321

  Pawar, M R ^a,b,c   Brown, W D ^a,d,e,f,g   Malshe, A P ^a   Naseem, H A ^a   Ang, S S ^a   Ulrich, R K ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

^b OSMANIA UNIVERSITY   (India)

^c Cirrus Logic   (United States)

^d 3202 Bell Engineering Center   (United States)

^e UNIVERSITY OF ARKANSAS   (United States)

^f PENNSYLVANIA STATE UNIVERSITY   (United States)

^g UNIVERSITY OF NEW MEXICO   (United States)

Author keywords

Chemical Vapor Deposition of Diamond; Microcavities; Multichip Modules; Planarization; Polyimide

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; BOND STRENGTH (MATERIALS); CHEMICAL VAPOR DEPOSITION; CRYSTAL STRUCTURE; ELECTRONICS PACKAGING; LIQUIDS; MICROELECTRONIC PROCESSING; POLYCRYSTALLINE MATERIALS; SUBSTRATES; SURFACE ROUGHNESS; THERMAL CYCLING;

COLUMNAR STRUCTURE; PLANARIZATION; POLYCRYSTALLINE STRUCTURE; SURFACE PITS;

DIAMOND FILMS;

EID: 0030246078     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. M.H. Gordon, S. Jamil, H.A. Naseem, W.D. Brown, and A.P. Malshe, "Part I - Thermal Management Analysis: Diamond for MCMs," HTD-Vol. 319/EEP-Vol. 15, Cooling and Thermal Design of Electronic Systems, ASME, pg. 145, 1995.
2. A.P. Malshe, S. Jamil, M.H. Gordon, H.A. Naseem, W.D. Brown, and L.W. Schaper, "Diamond For MCMs: A Thermal Management Simulation Study," Advanced Packaging, pp. 50-53, September/October 1995.
3. J.E. Butler, et al., "Thin Film Diamond Growth Mechanisms," Phil. Tran. R. Soc. Lond. A., Vol. 342, pp. 209-224, 1993.
4. K.E. Spear and J.P. Dismukes, eds., Synthetic Diamond: Emerging CVD Science and Technology, The Electrochemical Society Series, John Wiley & Sons, 1994.
5. A.P. Malshe, G.J. Glezen, H.A. Naseem, and W.D. Brown, "Recent Observations of Microcavities in CVD Diamond: Their Effects On MCM Processing," Proc. 4th Intl. Symp. Diamond Mats., ECS, Pennington, New Jersey, Vol. 95, No. 44, pp. 515-522, 1995.
6. A.P. Malshe, W.D. Brown, H.A. Naseem, and L.W. Schaper, "Method of Planarizing Polycrystalline Diamonds, Planarized Polycrystalline Diamonds and Products Made Therefrom," Patent Number 5,472,370, Issued December 5, 1995.
7. G. Sridhar Raju, "Chemical-Assisted Mechanical Polishing and Planarization of CVD-Diamond Substrates For MCM Applications," Master's Thesis, The University of Arkansas, December 1994.
8. Dupont Pyralin® LX Polyimide Coatings Technical Data Sheets.