Finite element analysis on soft-pad grinding of wire-sawn silicon wafers

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn , Issue , 2002, Pages 89-98

  Xin, X J ^a   Pei, Z J ^b   Liu, Wenjie ^a  

^a 129 Seaton Hall   (United States)

^b KANSAS STATE UNIVERSITY   (United States)

Author keywords

Element method; Grinding; Lapping; Machining; Material removal; Semiconductor material; Silicon wafers; Slicing

Indexed keywords

CHIP SCALE PACKAGES; FINITE ELEMENT METHOD; GRINDING (COMMINUTION); GRINDING (MACHINING); LAPPING; MECHANICAL ENGINEERING; MICROPROCESSOR CHIPS; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; WIRE;

ELEMENT METHOD; FINITE ELEMENT ANALYSIS; FINITE ELEMENT ANALYSIS MODELING; GRINDING; HIGH QUALITY SILICON WAFERS; MATERIAL REMOVAL; PAD MATERIAL; SLICING; SOFT-PAD GRINDING; SURFACE GRINDING; WAX MOUNTING; WIRE-SAWING; WIRE-SAWN WAFERS;

SILICON WAFERS;

EID: 78249243872     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-39277     Document Type: Conference Paper

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