The Effects of Nodular Colloidal Silica on Chemical Mechanical Polishing

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 8, 2003, Pages 4992-4997

  Haba, Shinichi ^a   Hong, Gisik ^b   Morioka, Yoshitaka ^b   Kobuchi, Yasushi ^b   Katoda, Takashi ^b  

^a KOCHI UNIVERSITY OF TECHNOLOGY   (Japan)

^b Rodel Nitta Company   (Japan)

Author keywords

Active porous surface; CMP; Fumed silica; Nodular colloidal silica slurry; p TEOS; Removal rate; Spherical colloidal silica; Surface morphology

Indexed keywords

COLLOIDS; DIELECTRIC FILMS; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SILICA; SURFACE ROUGHNESS;

REMOVAL RATES;

CHEMICAL MECHANICAL POLISHING;

EID: 0142075854     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.4992     Document Type: Article

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