Die cracking at solder (In60-Pb40) joints on brittle (GaAs) chips: Fracture correlation using critical bimaterial interface corner stress intensities

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 369-377

  Su, Bingzhi ^a,b   Lee, Y C ^a   Dunn, Martin L ^a  

^a UCB 450   (United States)

^b NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; ELASTICITY; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTERFACES (MATERIALS); SOLDERED JOINTS; STRESS ANALYSIS; STRESS INTENSITY FACTORS;

BIMATERIAL INTERFACE; DIE CRACKING; FRACTURE INITIATION;

SEMICONDUCTING GALLIUM ARSENIDE;

EID: 0142023809     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1602702     Document Type: Article

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