Opportunities and needs for interfacial fracture mechanics in microelectronic packaging industry

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 183-192

  Chen, William T ^a   Read, David ^b   Questad, David ^c   Sammakia, Bahgat ^c  

^a Department of Obstetrics Gynecology   (Singapore)

^b Natl Inst of Sci and Technology   (United States)

^c IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR MATERIALS;

BALL GRID ARRAY MODULE; CHIP SCALE PACKAGE; INTERFACIAL FRACTURE MECHANICS;

FRACTURE MECHANICS;

EID: 0031356983     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (20)

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