|
Volumn Part F133492, Issue , 1998, Pages 755-761
|
Packaging for a 40-channel parallel optical interconnection module with an over 25-Gb/s throughput
a
NTT CORPORATION
(Japan)
|
Author keywords
[No Author keywords available]
|
Indexed keywords
CHIP SCALE PACKAGES;
COST EFFECTIVENESS;
ELECTRIC POWER SYSTEM INTERCONNECTION;
INTEGRATED CIRCUIT INTERCONNECTS;
MULTIMODE FIBERS;
NETWORK COMPONENTS;
OPTICAL INTERCONNECTS;
OPTICAL WAVEGUIDES;
SURFACE EMITTING LASERS;
THROUGHPUT;
COMMUNICATION CHANNELS (INFORMATION THEORY);
INTEGRATED OPTOELECTRONICS;
OPTICAL FIBER COUPLING;
SEMICONDUCTOR LASERS;
OPTICAL INTERCONNECTION TECHNOLOGY;
PACKAGING STRUCTURE;
PACKAGING TECHNIQUES;
PARALLEL INTERCONNECTION;
PARALLEL OPTICAL INTERCONNECTION MODULES;
POLYMERIC OPTICAL WAVEGUIDES;
TRANSMITTER AND RECEIVER;
VERTICAL CAVITY SURFACE EMITTING LASER ARRAYS;
PACKAGING;
ELECTRONICS PACKAGING;
BARE FIBER (BF) CONNECTORS;
TRANSFERRED MULTICHIP BONDING (TMB);
VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL);
|
EID: 0031620460
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.1998.678792 Document Type: Conference Paper |
Times cited : (13)
|
References (11)
|