Thermoelastic expansion vs. piezoelectricity for high-frequency, 2-D arrays

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 50, Issue 8, 2003, Pages 1065-1068

  Buma, Takashi ^a   Spisar, Monica ^a   O'Donnell, Matthew ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; CARBON BLACK; FREQUENCIES; OPTICAL MICROSCOPY; PIEZOELECTRICITY; PLASTIC FILMS; THERMOELASTICITY; TWO DIMENSIONAL; ULTRASONICS;

CONVERSION EFFICIENCY; OPTICAL ABSORBING LAYER; THERMOELASTIC EXPANSION; TWO DIMENSIONAL ARRAYS;

POLYSILANES;

BAYSILON; DIMETICONE; SILICONE DERIVATIVE;

ECHOGRAPHY; ELASTICITY; EQUIPMENT; EQUIPMENT DESIGN; EVALUATION; INSTRUMENTATION; LETTER; METHODOLOGY; SENSITIVITY AND SPECIFICITY; TEMPERATURE; THEORETICAL MODEL; TRANSDUCER; VIBRATION;

DIMETHYLPOLYSILOXANES; ELASTICITY; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; MODELS, THEORETICAL; SENSITIVITY AND SPECIFICITY; SILICONES; TEMPERATURE; TRANSDUCERS; ULTRASONOGRAPHY; VIBRATION;

EID: 0141922841     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2003.1226551     Document Type: Letter

References (8)

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