Aerial image based mask inspection - A development effort to detect what might impact printing image quality on wafers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5038 I, Issue , 2003, Pages 177-184

  Liebe, Roman ^a   Haffner, Henning ^a   Hemar, Shirley ^b   Rosenbusch, Anja ^b   Chen, Jerry ^c   Kalk, Franklin ^c  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b Applied Materials Inc Israel   (Israel)

^c DuPont Photomasks Inc   (United States)

Author keywords

193nm technology; AAPSM; Aerial image based mask inspection; AIMS; MEEF; OPC; UIS10

Indexed keywords

IMAGE QUALITY; MASKS; PHOTOLITHOGRAPHY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS;

AERIAL IMAGE BASED MASK INSPECTION; ALTERNATING PHASE SHIFTING MASK; OPTICAL PROXIMITY CORRECTION;

OPTICAL VARIABLES MEASUREMENT;

EID: 0141835075     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.483535     Document Type: Conference Paper

References (6)

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2. L. S. Zurbrick, J. P. Heumann, M. W. Rudzinski, S. E. Stokowski, J. Urbach, L. Wang, "New approaches to alternating phase-shift mask inspection", SPIE 4562, pp. 138-144, 2002
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4. L. Larklin, M. M. Altamirano, L. Cai, K. A. Phan, C. Spence, "Automatic defect severity scoring for 193-nm reticle defect inspection", SPIE 4346, pp. 898-906, 2001
5. A. Rosenbusch, S. Hemar: "Inspecting Alternating PSM by Matching Stepper Conditions", Published in SPIE Proceedings Bacus 2002.
6. F. Chang at al: "Aerial image-based inspection of binary (OPC) and embedded-attenuated PSM", Published in SPIE Proceedings Bacus 2002.