Accurate double-height micromolding method for three-dimensional polydimethylsiloxane structures

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 7 A, 2003, Pages 4598-4601

  Denoual, Matthieu ^a   Griscom, Laurent ^b   Toshiyoshi, Hiroshi ^a   Fujita, Hiroyuki ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITÉ PARIS SACLAY   (France)

Author keywords

ICP RIE; Micromold; PDMS; SU 8; Three dimensional microfluidics

Indexed keywords

ASPECT RATIO; FLUIDIC DEVICES; MICROELECTRONIC PROCESSING; MOLDING; PHOTORESISTS; POLYMERIC MEMBRANES; REACTIVE ION ETCHING; SILICON WAFERS;

DOUBLE HEIGHT MICROMOLDING METHOD; MICROMOLDS; POLYDIMETHYLSILOXANE; THREE DIMENSIONAL MICROFLUIDICS;

SILICONES;

EID: 0141717882     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.4598     Document Type: Article

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