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Volumn 120, Issue 11, 2000, Pages 493-497

Multiple-height Microstructures Fabricated by ICP-RIE and Embedded Masking Layers

Author keywords

HARMS; ICP RIE; MEMS; multi height structure

Indexed keywords


EID: 85010155643     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.120.493     Document Type: Article
Times cited : (35)

References (11)
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    • (1998)
    • Abe, M.1    Esashi, M.2
  • 6
    • 0012636808 scopus 로고    scopus 로고
    • Delay-Masking Proc.ess for Silicon Three-Dimensional Bulk Structures
    • May.
    • M. Mita, Y. Mita, H. Toshiyoshi and H. Fujita, “Delay-Masking Proc.ess for Silicon Three-Dimensional Bulk Structures,” Trans. IEE Japan, Vol. 119-E, May. 1999, pp. 310311.
    • (1999) Trans. IEE Japan , pp. 310311
    • Mita, M.1    Mita, Y.2    Toshiyoshi, H.3    Fujita, H.4
  • 7
    • 85010173504 scopus 로고    scopus 로고
    • A Low Pressure Encapsulated DRIE Resonant Pressure Sensor Electrically Excited and Detected Using 'Burst' Tech.nology
    • Gif-sur-Yvette, France, Sep. 27-28
    • Jessica Melin, Peter Enoksson, Thierry Corman, Goran Stemme, “A Low Pressure Encapsulated DRIE Resonant Pressure Sensor Electrically Excited and Detected Using 'Burst' Tech.nology,” Proc.eedings of Micromechanics Europe (MME '99), Gif-sur-Yvette, France, Sep. 27-28, 1999, pp. 97-100
    • (1999) Proc.eedings of Micromechanics Europe (MME '99) , pp. 97-100
    • Melin, J.1    Enoksson, J.2    Corman, T.3    Stemme, G.4
  • 8
    • 85010091366 scopus 로고    scopus 로고
    • Multistep Deep Structuring of Silicon Using Wet Anisotropic Etching and Dry Etching Proc.esses for Micromechanical Purposes
    • Gif-sur-Yvette, France, Sep. 27-28
    • Vassil Ianev, Norbert Schwesinger, “Multistep Deep Structuring of Silicon Using Wet Anisotropic Etching and Dry Etching Proc.esses for Micromechanical Purposes,” Proc.eedings of Micromechanics Europe (MME '99), Gif-sur-Yvette, France, Sep. 27-28, 1999 pp. 160-163
    • (1999) Proc.eedings of Micromechanics Europe (MME '99) , pp. 160-163
    • Schwesinger, N.1    Ianev, V.2
  • 10
    • 85010141265 scopus 로고    scopus 로고
    • By modifying the default Proc.essing recipe supplied by the DRIE manufacturer, Plasma-Therm
    • Inc
    • By modifying the default Proc.essing recipe supplied by the DRIE manufacturer, Plasma-Therm, Inc.
  • 11
    • 0033692511 scopus 로고    scopus 로고
    • Embedded-Mask-Methods for mm-scale multi-layer vertical/slanted Si structures
    • Miyazaki, Japan, Jan. 23-27
    • Y. Mita, M. Mita, and H. Fujtia, “Embedded-Mask-Methods for mm-scale multi-layer vertical/slanted Si structures,” Tech. Digest of IEEE Micro Electro Mechanical Systems (MEMS 2000), Miyazaki, Japan, Jan. 23-27, 2000 pp. 300-305.
    • (2000) Tech. Digest of IEEE Micro Electro Mechanical Systems (MEMS 2000) , pp. 300-305
    • Mita, Y.1    Mita, M.2    Fujtia, H.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.