Electrical transconduction through organic layers Si-C bonded to silicon substrates

Microelectronic Engineering

Volumn 69, Issue 2-4, 2003, Pages 532-535

  Scandurra, A ^a   Indelli, G ^a   Compagnini, G ^b   Pignataro, S ^b  

^a STMICROELECTRONICS   (Italy)

^b UNIVERSITY OF CATANIA   (Italy)

Author keywords

SAM; STM; STS

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL BONDS; ELECTRIC CONDUCTIVITY; SCANNING TUNNELING MICROSCOPY; SELF ASSEMBLY; SILICON WAFERS;

ELECTRICAL TRANSCONDUCTION;

MICROELECTRONIC PROCESSING;

EID: 0141679620     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00343-5     Document Type: Conference Paper

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