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Volumn 13, Issue 5, 2003, Pages 634-645

Experimental evaluation and comparative analysis of commercial variable-capacitance MEMS accelerometers

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; CAPACITANCE; ELECTRONICS PACKAGING; MICROELECTRONIC PROCESSING; MICROSENSORS; SEMICONDUCTOR DEVICE MODELS; TEMPERATURE;

EID: 0141607072     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/5/315     Document Type: Article
Times cited : (94)

References (19)
  • 1
    • 0141841076 scopus 로고    scopus 로고
    • Inertial sensor technology trends
    • Barbour N and Schmidt G 2001 Inertial sensor technology trends IEEE Sensors J. 1 332-9
    • (2001) IEEE Sensors J. , vol.1 , pp. 332-339
    • Barbour, N.1    Schmidt, G.2
  • 2
    • 0032138896 scopus 로고    scopus 로고
    • Micromachined inertial sensors
    • Yazdi N, Ayazi F and Najafi K 1998 Micromachined inertial sensors Proc. IEEE 86 1640-58
    • (1998) Proc. IEEE , vol.86 , pp. 1640-1658
    • Yazdi, N.1    Ayazi, F.2    Najafi, K.3
  • 3
    • 4243336704 scopus 로고    scopus 로고
    • Accelerometer selection based on applications
    • Endevco Technical Paper TP291
    • Chu A Accelerometer selection based on applications Endevco Technical Paper TP291
    • Chu, A.1
  • 4
    • 26144446741 scopus 로고    scopus 로고
    • Minimizing measurement uncertainty in calibration and use of accelerometers
    • Endevco Technical Paper TP299
    • Sill R D Minimizing measurement uncertainty in calibration and use of accelerometers Endevco Technical Paper TP299
    • Sill, R.D.1
  • 6
    • 26144466901 scopus 로고    scopus 로고
    • Shock and vibration measurement using variable capacitance
    • Endevco Technical Paper TP296
    • Olney D and Link B Shock and vibration measurement using variable capacitance Endevco Technical Paper TP296
    • Olney, D.1    Link, B.2
  • 7
    • 0141841083 scopus 로고    scopus 로고
    • Webpage http://www.endevco.com
  • 8
    • 0141617752 scopus 로고    scopus 로고
    • Webpage http://www.analogdevices.com
  • 9
    • 0141506369 scopus 로고    scopus 로고
    • Webpage http://www.silicondesigns.com
  • 10
    • 4243334491 scopus 로고    scopus 로고
    • Semiconductor accelerometer having reduced sensor plate flexure
    • US Patent 5,814,727 Motorola, Inc
    • Semiconductor accelerometer having reduced sensor plate flexure US Patent 5,814,727 Motorola, Inc
  • 11
    • 0034960338 scopus 로고    scopus 로고
    • Low stress packaging of a micromachined accelerometer
    • Li G and Tseng A A 2001 Low stress packaging of a micromachined accelerometer IEEE Trans. Packaging Manuf. 24 18-25
    • (2001) IEEE Trans. Packaging Manuf. , vol.24 , pp. 18-25
    • Li, G.1    Tseng, A.A.2
  • 12
    • 0141617750 scopus 로고    scopus 로고
    • Webpage http://motorola.com/semiconductors/
  • 13
    • 0141617746 scopus 로고    scopus 로고
    • 70g full scale accelerometer designed to survive 100,000g overrange
    • Endevco Technical Paper TP300
    • Sill R D A 70g full scale accelerometer designed to survive 100,000g overrange Endevco Technical Paper TP300
    • Sill, R.D.A.1
  • 15
    • 4243289406 scopus 로고    scopus 로고
    • Miniature accelerometers for measuring inertial motions and surviving high g shock inputs
    • Endevco Technical Paper TP303
    • Whittier R and Connolly T Miniature accelerometers for measuring inertial motions and surviving high g shock inputs Endevco Technical Paper TP303
    • Whittier, R.1    Connolly, T.2
  • 16
    • 0141617751 scopus 로고    scopus 로고
    • Webpage http://wwwideal-aerosmithcom/1068-2.html
  • 17
    • 0034289113 scopus 로고    scopus 로고
    • Transient and impact dynamics of a micro-accelerometer
    • Li G and Tseng A A 2000 Transient and impact dynamics of a micro-accelerometer J. Mater. Process. Manuf. Sci. 9 143-56
    • (2000) J. Mater. Process. Manuf. Sci. , vol.9 , pp. 143-156
    • Li, G.1    Tseng, A.A.2
  • 18
    • 0027567658 scopus 로고
    • Mechanical stability and adhesion of microstructures under capillary forces
    • Mastrangelo C H and Hsu C H 1993 Mechanical stability and adhesion of microstructures under capillary forces J. Microelectromech. Syst. 2 33-55
    • (1993) J. Microelectromech. Syst. , vol.2 , pp. 33-55
    • Mastrangelo, C.H.1    Hsu, C.H.2
  • 19
    • 0141505870 scopus 로고    scopus 로고
    • JAHM Software, Inc. Material Properties Database v5.0
    • JAHM Software, Inc. Material Properties Database v5.0 webpage http://www.jahm.com


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.